Semiconductor Packaging

As the performance of electronic devices such as smartphones and laptops has rapidly developed recently, so semiconductor packaging was also becoming high integration.

Semiconductor packaging is one of the eight major steps to semiconductor fabrication and important factors in semiconductor fabrication. And molding is required to cover semiconductor substrates to protect against external impacts and humidity.

The research is being conducted with the aim of low thermal expansion, high thermal conductivity, and high moldability of the compound. Accordingly, the optimal composition of materials and various analysis according to the influence of additives are being performed.